(160kV) 3D X-ray Nano-Scale Computed Tomography-HPC

The (160kV) 3D X-ray Nano-Scale Computed Tomography-High-Performance Computing (HPC) represents an advanced imaging technique that seamlessly integrates a high-energy X-ray source with sophisticated computational capabilities for detailed three-dimensional analysis of nanoscale structures . This cutting-edge approach is designed to unveil the intricate internal features of materials with unprecedented precision.


At its core, the method involves subjecting a sample to rotational scanning, where high-energy X-rays at 160 kilovolts penetrate through the material, capturing projections at multiple angles. These X-ray projections, showcasing the material's attenuation characteristics, form the basis of a comprehensive dataset. What sets this technique apart is the subsequent reconstruction process, empowered by High-Performance Computing. The computational prowess enables the rapid and intricate reconstruction of a high-resolution 3D volume from the acquired projections.


The (160kV) 3D X-ray Nano-Scale Computed Tomography-HPC approach provides researchers and scientists with an unparalleled tool for non-destructive exploration and analysis of nanoscale structures. From materials science to biology, the application of this technique opens new avenues for understanding and characterizing the internal morphology, distribution, and features of nanomaterials, contributing significantly to advancements in diverse scientific fields.



Excillum NanoTube N3 X-ray Source


The Excillum NanoTube N3 provides geometric-magnification X-ray imaging systems with industry-leading stability and resolution without the need for manual adjusting.


Advanced tungsten-diamond transmission target technology and sophisticated electron optics form the foundation of the Excillum NanoTube N3. Every time, the smallest, roundest spot is produced owing to the automatic e-beam focusing and astigmatism correction.


Moreover, the NanoTube N3 has the distinctive capability of monitoring and reporting the current spot size inside. Furthermore, cutting-edge cooling and thermal design produce extraordinary stability over lengthy exposures. This permits a real resolution of 150 nm lines and spaces.

Dectris EIGER2 R  CdTe 500K Detector


Number of modules


1 x 1 = 1
Sensor Cadmium Telluride (CdTe) 
Sensor material  Silicon (Si)
Sensor thickness 750 µm 
Pixel size (W x H) 75 µm x 75 µm
Pixel array format (W x H) 1028 pixels x 512 pixels = 526 336 pixels 
Active area (W x H) 77.1mm x 38.4mm = 2977.99mm 2
Intra-module gap 2 pixels wide vertical gap in the center of each module
Defective pixels  < 0.1%
Image bit depth 32 bit or 16 bit
Readout bit depth 16 bits 
Maximum count rate  9.8 × 10 photons/s/mm 2
Adjustable threshold range 4keV to 30keV
Energy range 8keV to 25keV
Number of thresholds two independent thresholds 
Readout time  continuous readout with 100 ns dead time
Maximum frame rate  100 Hz
Point-spread function 1 pixel (FWHM) 
Connection to detector control unit 1 x LC/UPC duplex fiber optic connectors
Power supply  External power supply unit
Software interface HTTP REST interface
Dimensions (W x H x D)  114mm x 92mm x 241.5mm
Weight  3.7kg
Maximum operating altitude  2000m asl 


Lab Motion Systems RT150ST


Bearing type air bearing
Max. speed 725 RPM
Max.axial load 226N
Radial error motion < 100nm
Axial error motion  <50nm
Angular accuracy ± 6.9 arcsec
Nominal torque 1.5Nm
Peak torque  2.5Nm
Total mass 6.2kg 

Lab Motion Systems XY150B-12


Bearing type ball bearing
Stroke ±6mm
Load capacity 10kg
Min. Incr. motion 0.1 µm
Repeatability ±0.2 µm
Speed 0.22mm/s
Total mass 2.1kg
Material coated aluminum
Optimal compatibility